%0 Journal Article %1 journals/tie/KimPLLC22 %A Kim, Ki-Duk %A Park, Seunghyun %A Lee, Byunghun %A Lee, Hyung-Min %A Cho, Gyu-Hyeong %D 2022 %J IEEE Trans. Ind. Electron. %K dblp %N 8 %P 8604-8608 %T A 80x60 Microbolometer CMOS Thermal Imager Integrated With a Low-Noise 12-B DAC. %U http://dblp.uni-trier.de/db/journals/tie/tie69.html#KimPLLC22 %V 69

@article{journals/tie/KimPLLC22, added-at = {2022-04-01T00:00:00.000+0200}, author = {Kim, Ki-Duk and Park, Seunghyun and Lee, Byunghun and Lee, Hyung-Min and Cho, Gyu-Hyeong}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/29a47c9eb2dc2fc34f61fa84f95de3308/dblp}, ee = {https://doi.org/10.1109/TIE.2021.3109542}, interhash = {2b3f0d82c251b29c514478b8572fb7f0}, intrahash = {9a47c9eb2dc2fc34f61fa84f95de3308}, journal = {IEEE Trans. Ind. Electron.}, keywords = {dblp}, number = 8, pages = {8604-8608}, timestamp = {2022-06-02T06:09:40.000+0200}, title = {A 80x60 Microbolometer CMOS Thermal Imager Integrated With a Low-Noise 12-B DAC.}, url = {http://dblp.uni-trier.de/db/journals/tie/tie69.html#KimPLLC22}, volume = 69, year = 2022 }