%0 Journal Article %1 journals/mr/Weide-ZaageSRVR14 %A Weide-Zaage, Kirsten %A Schlobohm, J. %A Rongen, R. T. H. %A Voogt, F. C. %A Roucou, R. %D 2014 %J Microelectronics Reliability %K dblp %N 6-7 %P 1206-1211 %T Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core. %U http://dblp.uni-trier.de/db/journals/mr/mr54.html#Weide-ZaageSRVR14 %V 54

@article{journals/mr/Weide-ZaageSRVR14, added-at = {2014-08-06T00:00:00.000+0200}, author = {Weide-Zaage, Kirsten and Schlobohm, J. and Rongen, R. T. H. and Voogt, F. C. and Roucou, R.}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2d08f262b01a7cbd77593ca80a372af30/dblp}, ee = {http://dx.doi.org/10.1016/j.microrel.2014.02.021}, interhash = {25a3f3463025ae09b49b8fbef46ae196}, intrahash = {d08f262b01a7cbd77593ca80a372af30}, journal = {Microelectronics Reliability}, keywords = {dblp}, number = {6-7}, pages = {1206-1211}, timestamp = {2016-02-02T02:02:28.000+0100}, title = {Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr54.html#Weide-ZaageSRVR14}, volume = 54, year = 2014 }