%0 Journal Article %1 journals/mr/PoshtanRSW16 %A Poshtan, Emad A. %A Rzepka, Sven %A Silber, Christian %A Wunderle, Bernhard %D 2016 %J Microelectronics Reliability %K dblp %P 18-25 %T An in-situ numerical-experimental approach for fatigue delamination characterization in microelectronic packages. %U http://dblp.uni-trier.de/db/journals/mr/mr62.html#PoshtanRSW16 %V 62

@article{journals/mr/PoshtanRSW16, added-at = {2016-07-12T00:00:00.000+0200}, author = {Poshtan, Emad A. and Rzepka, Sven and Silber, Christian and Wunderle, Bernhard}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2962abd4f74001d52183a1955310f6410/dblp}, ee = {http://dx.doi.org/10.1016/j.microrel.2016.03.017}, interhash = {215a958841ab008a000e05bbd2f723e7}, intrahash = {962abd4f74001d52183a1955310f6410}, journal = {Microelectronics Reliability}, keywords = {dblp}, pages = {18-25}, timestamp = {2016-07-13T09:32:03.000+0200}, title = {An in-situ numerical-experimental approach for fatigue delamination characterization in microelectronic packages.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr62.html#PoshtanRSW16}, volume = 62, year = 2016 }