%0 Journal Article %1 journals/mr/LinCLL05 %A Lin, Y. C. %A Chen, X. %A Liu, Xingsheng %A Lu, Guo-Quan %D 2005 %J Microelectronics Reliability %K dblp %N 1 %P 143-154 %T Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling. %U http://dblp.uni-trier.de/db/journals/mr/mr45.html#LinCLL05 %V 45

@article{journals/mr/LinCLL05, added-at = {2007-03-27T00:00:00.000+0200}, author = {Lin, Y. C. and Chen, X. and Liu, Xingsheng and Lu, Guo-Quan}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/27d50a75d251bce4b772aaed942301f51/dblp}, ee = {http://dx.doi.org/10.1016/j.microrel.2004.06.009}, interhash = {1ff016cffa4e34d8599534535c2b04ff}, intrahash = {7d50a75d251bce4b772aaed942301f51}, journal = {Microelectronics Reliability}, keywords = {dblp}, number = 1, pages = {143-154}, timestamp = {2016-02-02T02:02:28.000+0100}, title = {Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr45.html#LinCLL05}, volume = 45, year = 2005 }