%0 Conference Paper %1 conf/3dic/LamyCSLCL13 %A Lamy, Y. %A Colonna, J.-P. %A Simon, G. %A Leduc, Patrick %A Cheramy, Séverine %A Laviron, C. %B 3DIC %D 2013 %I IEEE %K dblp %P 1-6 %T Which interconnects for which 3D applications? Status and perspectives. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#LamyCSLCL13 %@ 978-1-4673-6484-3

@inproceedings{conf/3dic/LamyCSLCL13, added-at = {2017-05-21T00:00:00.000+0200}, author = {Lamy, Y. and Colonna, J.-P. and Simon, G. and Leduc, Patrick and Cheramy, Séverine and Laviron, C.}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/23983cb1f2b740debfab6e5af802a68a5/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2013}, ee = {https://doi.org/10.1109/3DIC.2013.6702344}, interhash = {1facf3bf842ca53f5a17ed353743eec9}, intrahash = {3983cb1f2b740debfab6e5af802a68a5}, isbn = {978-1-4673-6484-3}, keywords = {dblp}, pages = {1-6}, publisher = {IEEE}, timestamp = {2019-09-27T13:40:43.000+0200}, title = {Which interconnects for which 3D applications? Status and perspectives.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#LamyCSLCL13}, year = 2013 }