%0 Journal Article %1 journals/jolpe/DengL06 %A Deng, Yangdong %A Li, Peng %D 2006 %J J. Low Power Electronics %K dblp %N 2 %P 177-188 %T Temperature-Aware Floorplanning of 3-D ICs Considering Thermally Dependent Leakage Power. %U http://dblp.uni-trier.de/db/journals/jolpe/jolpe2.html#DengL06 %V 2

@article{journals/jolpe/DengL06, added-at = {2007-07-27T00:00:00.000+0200}, author = {Deng, Yangdong and Li, Peng}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/21f378c20a56ea6acdaa8aeb0ffb78923/dblp}, ee = {http://dx.doi.org/10.1166/jolpe.2006.072}, interhash = {1e7953b5fc547377ac5500ddc8dc4585}, intrahash = {1f378c20a56ea6acdaa8aeb0ffb78923}, journal = {J. Low Power Electronics}, keywords = {dblp}, number = 2, pages = {177-188}, timestamp = {2016-02-02T01:37:39.000+0100}, title = {Temperature-Aware Floorplanning of 3-D ICs Considering Thermally Dependent Leakage Power.}, url = {http://dblp.uni-trier.de/db/journals/jolpe/jolpe2.html#DengL06}, volume = 2, year = 2006 }