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%0 Journal Article
%1 journals/mr/LauMPLNAG13
%A Lau, F. L.
%A Made, Riko I.
%A Putra, W. N.
%A Lim, J. Z.
%A Nachiappan, V. C.
%A Aw, J. L.
%A Gan, Chee Lip
%D 2013
%J Microelectronics Reliability
%K dblp
%N 9-11
%P 1581-1586
%T Electrical behavior of Au-Ge eutectic solder under aging for solder bump application in high temperature Electronics.
%U http://dblp.uni-trier.de/db/journals/mr/mr53.html#LauMPLNAG13
%V 53
@article{journals/mr/LauMPLNAG13,
added-at = {2018-11-30T00:00:00.000+0100},
author = {Lau, F. L. and Made, Riko I. and Putra, W. N. and Lim, J. Z. and Nachiappan, V. C. and Aw, J. L. and Gan, Chee Lip},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2206b07107f6a186054ab4bf9020496ec/dblp},
ee = {https://doi.org/10.1016/j.microrel.2013.07.081},
interhash = {1c15ad980b62cb9fcd89df66ab05ff54},
intrahash = {206b07107f6a186054ab4bf9020496ec},
journal = {Microelectronics Reliability},
keywords = {dblp},
number = {9-11},
pages = {1581-1586},
timestamp = {2019-09-27T10:58:31.000+0200},
title = {Electrical behavior of Au-Ge eutectic solder under aging for solder bump application in high temperature Electronics.},
url = {http://dblp.uni-trier.de/db/journals/mr/mr53.html#LauMPLNAG13},
volume = 53,
year = 2013
}
