%0 Conference Paper %1 conf/asicon/HouBW11 %A Hou, Ligang %A Bai, Shu %A Wang, Jinhui %B ASICON %D 2011 %I IEEE %K dblp %P 816-819 %T TSV based 3D IC wire length calculation algorithm. %U http://dblp.uni-trier.de/db/conf/asicon/asicon2011.html#HouBW11 %@ 978-1-61284-192-2

@inproceedings{conf/asicon/HouBW11, added-at = {2016-06-22T00:00:00.000+0200}, author = {Hou, Ligang and Bai, Shu and Wang, Jinhui}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/255cd5877ff775b29098c9217c7ea42d9/dblp}, booktitle = {ASICON}, crossref = {conf/asicon/2011}, ee = {http://dx.doi.org/10.1109/ASICON.2011.6157330}, interhash = {19c0d268c3a612faf0b9598ab6edb6bd}, intrahash = {55cd5877ff775b29098c9217c7ea42d9}, isbn = {978-1-61284-192-2}, keywords = {dblp}, pages = {816-819}, publisher = {IEEE}, timestamp = {2016-06-23T09:32:33.000+0200}, title = {TSV based 3D IC wire length calculation algorithm.}, url = {http://dblp.uni-trier.de/db/conf/asicon/asicon2011.html#HouBW11}, year = 2011 }