%0 Journal Article %1 journals/mr/Wang02 %A Wang, Jinlin %D 2002 %J Microelectronics Reliability %K dblp %N 2 %P 293-299 %T Underfill of flip chip on organic substrate: viscosity, surface tension, and contact angle. %U http://dblp.uni-trier.de/db/journals/mr/mr42.html#Wang02 %V 42

@article{journals/mr/Wang02, added-at = {2007-03-25T00:00:00.000+0100}, author = {Wang, Jinlin}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2c4f6e2656cb749fb15b7ef31ba5a57af/dblp}, ee = {http://dx.doi.org/10.1016/S0026-2714(01)00231-1}, interhash = {0f3458ee9ad86ddc5d3929b1f04c9a34}, intrahash = {c4f6e2656cb749fb15b7ef31ba5a57af}, journal = {Microelectronics Reliability}, keywords = {dblp}, number = 2, pages = {293-299}, timestamp = {2016-02-02T02:00:24.000+0100}, title = {Underfill of flip chip on organic substrate: viscosity, surface tension, and contact angle.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr42.html#Wang02}, volume = 42, year = 2002 }