%0 Journal Article %1 journals/mr/LiangLHL14 %A Liang, Jiaxing %A Luo, Tingbi %A Hu, Anmin %A Li, Ming %D 2014 %J Microelectronics Reliability %K dblp %N 1 %P 245-251 %T Formation and growth of interfacial intermetallic layers of Sn-8Zn-3Bi-0.3Cr on Cu, Ni and Ni-W substrates. %U http://dblp.uni-trier.de/db/journals/mr/mr54.html#LiangLHL14 %V 54

@article{journals/mr/LiangLHL14, added-at = {2014-08-06T00:00:00.000+0200}, author = {Liang, Jiaxing and Luo, Tingbi and Hu, Anmin and Li, Ming}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/243adce3862b4cbdb46fb68583dd2e600/dblp}, ee = {http://dx.doi.org/10.1016/j.microrel.2013.08.008}, interhash = {0c5e66060ea2c7894fac379d59ad9268}, intrahash = {43adce3862b4cbdb46fb68583dd2e600}, journal = {Microelectronics Reliability}, keywords = {dblp}, number = 1, pages = {245-251}, timestamp = {2016-02-02T02:00:49.000+0100}, title = {Formation and growth of interfacial intermetallic layers of Sn-8Zn-3Bi-0.3Cr on Cu, Ni and Ni-W substrates.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr54.html#LiangLHL14}, volume = 54, year = 2014 }