%0 Journal Article %1 journals/mr/ZhengSYF03 %A Zheng, Y. S. %A Su, Y. J. %A Yu, B. %A Foo, P. D. %D 2003 %J Microelectronics Reliability %K dblp %N 8 %P 1311-1316 %T Investigation of defect on copper bond pad surface in copper/low k process integration. %U http://dblp.uni-trier.de/db/journals/mr/mr43.html#ZhengSYF03 %V 43

@article{journals/mr/ZhengSYF03, added-at = {2007-03-25T00:00:00.000+0100}, author = {Zheng, Y. S. and Su, Y. J. and Yu, B. and Foo, P. D.}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2ab933acf825ab2fd3d602ffc56924683/dblp}, ee = {http://dx.doi.org/10.1016/S0026-2714(03)00134-3}, interhash = {02f933f58178210314b943e8e0384cf7}, intrahash = {ab933acf825ab2fd3d602ffc56924683}, journal = {Microelectronics Reliability}, keywords = {dblp}, number = 8, pages = {1311-1316}, timestamp = {2016-02-02T02:01:27.000+0100}, title = {Investigation of defect on copper bond pad surface in copper/low k process integration.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr43.html#ZhengSYF03}, volume = 43, year = 2003 }