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Conceptual Planning of Micro-Assembly for a Better Utilization of Reconfigurable Manufacturing Systems, , , and . Applied Sciences, 10 (8): 2806 (2020)Effect of high current pulses on solder interfacial reaction and interconnect reliability, , , and . Microelectronics reliability, 122 (July): 114151 (2021)Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist, , , , , and . Micromachines, 12 (8): 856 (2021)Investigation of Focused Ion and Electron Beam Platinum Carbon Nano-Tips with Transmission Electron Microscopy for Quantum Tunneling Vacuum Gap Applications, , , and . Applied Sciences, 11 (24): 11793 (2021)A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation, , , , and . IEEE Access, (2019)Assembly of Components on Inkjet-Printed Silver Structures by Soldering, , , , and . IEEE Transactions on Components Packaging and Manufacturing Technology, 9 (1): 156-162 (2019)Fabrication of curved diffractive optical elements by means of laser direct writing, electroplating, and injection compression molding, , , , , , and . Journal of Manufacturing Processes, (2019)Minimally Invasive Sensors for Transurethral Impedance Spectroscopy, , , , , and . IEEE sensors journal, 21 (20): 22858-22867 (2021)CMOS-Compatible Measures for Thermal Management of Phase-Sensitive Silicon Photonic Systems, , and . Photonics, 7 (1): 6 (2020)Feasibility Study of Soft Tooling Inserts for Injection Molding with Integrated Automated Slides, , , , and . Micromachines, 12 (7): 730 (2021)