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Spin, Spray and Eloctroplating of Photoresist for MEMS Structures : A Comparison

, , , and . 2002 proceedings : SAFE-ProRISC-SeSens, November 27 - 29, 2002, Veldhoven, the Netherlands, page 81-86. (2002)

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Metal Patterning on High Topography Surface For 3-D RF Devices Fabrication, , , , , and . Eurosensors XVII : September 21 - 24, 2003, Guimarães, Portugal : book of abstracts : the 17th European Conference on Solid State Transducers, (2003)RF-Devices Realised in MEMS by Using Electrodepositable Photoresist, , , and . Book of abstracts : SAFE2001 Semiconductor Advances for Future Electronics, ProRISC2001 Program for Research on Integrated Systems and Circuits, SeSens2001 Semiconductor Sensor and Actuator Technology, Utrecht, STW, Technology Foundation, (2001)Copper Electroplating for Integrated RF Devices, , and . Proceedings 10th annual workshop on Circuits, Systems and Signal Processing ProRisc99. : 2nd Annual workshop on Semiconductor Advances for Future Electronics SAFE99, page 733-738. Utrecht, STW, Technology Foundation, (1999)Integrated solenoid inductors with patterned, sputter-deposited Cr/Fe/sub 10/Co/sub 90//Cr ferromagnetic cores, , , , and . IEEE Electron Device Letters, 24 (4): 224-226 (April 2003)Direct Spray Coating Of Photoresist : A New Method For Patterning 3-D Structures, , , , , and . Book of abstracts : Eurosensors XVI, The 16th European Conference on Solid-State Transducers, September 15 - 18, 2002, Prague, Czech Republic, page 89-90. Prag, Czech Technical University, (2002)Study of Magnetic On-Chip Inductors, , , , and . Book of abstracts : SAFE2001 Semiconductor Advances for Future Electronics, ProRISC2001 Program for Research on Integrated Systems and Circuits, SeSens2001 Semiconductor Sensor and Actuator Technology, page 229-233. Utrecht, STW, Technology Foundation, (2001)Through-Silicon-Chip Transmission Lines, , , and . Electronics Letters, 38 (13): 640-641 (June 2002)Investigation of Microstrips with NiFe Magnetic Thin Film (I) : Experiment, , , , and . Transactions of the Magnetics Society of Japan, 2 (5): 367-370 (2002)Substrate options and add-on process modules for monolithic RF silicon technology, , , , , , , and . Proceedings of the Bipolar/BiCMOS Circuits and Technology Meeting, page 17-23. Piscataway, New Jersey, IEEE, (2002)Photoresist coating methods for the integration of novel 3-D RF microstructures, , , and . Journal of Microelectromechanical Systems, 13 (3): 491-499 (June 2004)