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Advanced FIB sample preparation techniques for high resolution TEM investigations of HEMT structures., , , and . Microelectronics Reliability, 54 (9-10): 1785-1789 (2014)Detection and analysis of stress-induced voiding in Al-power lines by acoustic GHz-microscopy., , , , , and . Microelectronics Reliability, (2016)Reliability evaluation of Si-dies due to assembly issues., , , and . Microelectronics Reliability, (2016)Lock-in thermal IR imaging using a solid immersion lens., , , , and . Microelectronics Reliability, 46 (9-11): 1508-1513 (2006)High resolution physical analysis of ohmic contact formation at GaN-HEMT devices., , , , , , , , , and . Microelectronics Reliability, (2017)New Access to Soft Breakdown Parameters of Low-k Dielectrics Through Localisation-Based Analysis., , , , , , , , , and 1 other author(s). IRPS, page 1-9. IEEE, (2019)Novel techniques for dopant contrast analysis on real IC structures., , and . Microelectronics Reliability, 52 (9-10): 2098-2103 (2012)Magnetic field and current density imaging using off-line lock-in analysis., , , and . Microelectronics Reliability, (2016)Novel failure mode of chip corrosion at automotive HALL sensor devices under multiple stress conditions., , , and . Microelectronics Reliability, (2016)Exploring the thermal limit of GaN power devices under extreme overload conditions., , , , , , , and . Microelectronics Reliability, (2017)