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High-Q inductors in standard silicon interconnect technology and its application to an integrated RF power amplifier

J. Burghartz, M. Soyuer, K. Jenkins, and M. Hulvey. Technical digest : International Electron Devices Meeting 1995, IEDM, Washington, DC, December 10-13, 1995, page 1015-1018. Piscataway, New Jersey, IEEE, (1995)
DOI: 10.1109/IEDM.1995.499389

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A. Laukemann

Allison Keith University of Stuttgart

Christopher Jenkins University of Stuttgart

A. Laukemann

A. Laukemann

Other publications of authors with the same name

On-chip circuit to monitor long-term NBTI and PBTI degradation.K. Jenkins, and P. Lu. Microelectronics Reliability, 53 (9-11): 1252-1256 (2013)A simple array-based test structure for the AC variability characterization of MOSFETs.K. Balakrishnan, K. Jenkins, and D. Boning. ISQED, page 539-544. IEEE, (2011)Application of an SOI 0.12-µm CMOS technology to SoCs with low-power and high-frequency circuits.J. Plouchart, N. Zamdmer, J. Kim, M. Sherony, Y. Tan, A. Ray, M. Talbi, L. Wagner, K. Wu, N. Lustig and 11 other author(s). IBM Journal of Research and Development, 47 (5-6): 611-630 (2003)Detecting and Preventing Measurement Errors.K. Jenkins. IEEE Design & Test of Computers, 14 (4): 78-86 (1997)Statistical Characterization and On-Chip Measurement Methods for Local Random Variability of a Process Using Sense-Amplifier-Based Test Structure.S. Mukhopadhyay, K. Kim, K. Jenkins, C. Chuang, and K. Roy. ISSCC, page 400-611. IEEE, (2007)On-Chip Circuit for Measuring Period Jitter and Skew of Clock Distribution Networks.K. Jenkins, K. Shepard, and Z. Xu. CICC, page 157-160. IEEE, (2007)A statistical critical path monitor in 14nm CMOS.B. Fleischer, C. Vezyrtzis, K. Balakrishnan, and K. Jenkins. ICCD, page 507-511. IEEE Computer Society, (2016)An On-Chip Test Structure and Digital Measurement Method for Statistical Characterization of Local Random Variability in a Process.S. Mukhopadhyay, K. Kim, K. Jenkins, C. Chuang, and K. Roy. J. Solid-State Circuits, 43 (9): 1951-1963 (2008)SiGe power HBT's for low-voltage, high-performance RF applicationsJ. Burghartz, J. Plouchart, K. Jenkins, C. Webster, and M. Soyuer. IEEE Electron Device Letters, 19 (4): 103-105 (April 1998)Spiral inductors and transmission lines in silicon technology using copper-damascene interconnects and low-loss substratesJ. Burghartz, D. Edelstein, K. Jenkins, and Y. Kwark. IEEE Transactions on Microwave Theory and Techniques, 45 (10): 1961-1968 (October 1997)