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Disambiguation of "Beck, M."

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Accuracy of fully coupled and sequential approaches for modeling hydro- and geomechanical processes

, , , and . Computational Geosciences, 24 (1): 1707–1723 (2020)
DOI: 10.1007/s10596-020-09987-w

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Matthias Beck

Matthias Beck

Matthias Beck

Franziska Becker University of Stuttgart

Dr. -Ing. Andre Beck University of Stuttgart

 

Other publications of authors with the same name

Fault diagnosis of dynamical systems using recurrent fuzzy systems with application to an electrohydraulic servo axis., , and . Fuzzy Sets and Systems, (2015)Modelling real contact areas caused by material straining effects in sheet metal forming simulation, , , and . Proceedings of ESAFORM, (April 2021)Compensation of elastic die and press deformations during sheet metal forming by optimizing blank holder design, , , , and . IOP Conference Series: Materials Science and Engineering, (November 2020)Accuracy of fully coupled and sequential approaches for modeling hydro- and geomechanical processes, , , and . Computational Geosciences, 24 (1): 1707–1723 (2020)Compensation of elastic die and press deformations during sheet metal forming by optimizing blank holder design, , , , and . International Deep-Drawing Research Group (IDDRG 2020), 967, page 012074. Institute of Physics, (2020)Active and Real-Time Functionalities for Electronic Brokerage Design., , , , and . WECWIS, page 30-35. IEEE Computer Society, (1999)Course on Simulation in Information Technology: the Global System for Mobile communications., , , , , and . ICASSP, page 1129-1132. IEEE Computer Society, (1995)MPI-IO/L: efficient remote I/O for MPI-IO via logistical networking., , , , and . IPDPS, IEEE, (2006)An Evolutionary, Agent-Assisted Strategy for Conceptual Design Space Decomposition., and . Evolutionary Computing, AISB Workshop, volume 1305 of Lecture Notes in Computer Science, page 275-286. Springer, (1997)Extended metallization reliability testing: Combining standard wafer level with product tests to increase test sensitivity., , , , , , , , and . Microelectronics Reliability, 49 (1): 74-78 (2009)