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Disambiguation of "Polyakov, Aleksandr"

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Mechanical Reliability of Silicon Wafers With Through-Wafer Vias for Wafer-Level Packaging

, , and . Microelectronics Reliability, 42 (9-11): 1783-1788 (September 2002)
DOI: 10.1016/S0026-2714(02)00231-7

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Other publications of authors with the same name

Wafer-Level Chip-Scale Packaging for RF Applications, , , , and . (2003)Area-Selective Adhesive Bonding Using Photosensitive BCB For WL CSP Applications, , and . Journal of Electronic Packaging, (March 2005)Characterization of high-resistivity polycrystalline silicon substrates for wafer-level packaging and integration of RF passives, , , , , and . The Fifth International Conference on Advanced Semiconductor Devices and Microsystems, 2004. ASDAM 2004., page 227-230. Piscataway, New Jersey, IEEE, (2004)Wafer-Level Packaging for RF Applications Using High-Resistivity Polycrystalline Silicon Substrate Technology, , , and . Proceedings : 2004 International Symposium on Microelectronics, November 14-18, 2004, Long Beach Convention Center, Long Beach, Ca, Washington D.C., International Microelectronics and Packaging Society, (2004)Wafer-level chip-scale packaging for low-end RF products, , , , , , and . Digest of papers : 2004 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 2004, page 41-44. Piscataway, New Jersey, IEEE, (2004)Substrate Thinning and Trenching as Crosstalk Suppression Techniques, , , and . Proceedings : 3rd European Microelectronics and Packaging Symposium with Table Top Exhibition : 16th to 18th June 2004, Hotel Diplomat, Prague, Czech Republic, page 131-136. Lanskroun, IMAPS CZ & SK Chapter, (2004)Folded-Patch Chip-Size Antennas for Wireless Microsystems Using Wafer-Level Chip-Scale Packaging, , , , and . page 77-80. (2003)Mechanical Reliability of Silicon Wafers With Through-Wafer Vias for Wafer-Level Packaging, , and . Microelectronics Reliability, 42 (9-11): 1783-1788 (September 2002)An Investigation into Mechanical Strength of Silicon Wafers with Bulk-Micromachined Structures, , and . Book of abstracts : SAFE2001 Semiconductor Advances for Future Electronics, ProRISC2001 Program for Research on Integrated Systems and Circuits, SeSens2001 Semiconductor Sensor and Actuator Technology, page 163-166. Utrecht, STW, Technology Foundation, (2001)RF Crosstalk Suppression Based On Wafer-Level Packaging Concept, , , and . (2006)