Author of the publication

Discontinuous Powder Aerosol Deposition : An Approach to Prepare Films Using Smallest Powder Quantities

, , , , , and . Coatings, 11 (7): 844 (2021)
DOI: 10.3390/coatings11070844

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

No persons found for author name Kita, Jaroslaw
add a person with the name Kita, Jaroslaw
 

Other publications of authors with the same name

Investigation of the short-time high-current behavior of vias manufactured in hybrid thick-film technology., , , , , and . Microelectronics Reliability, 51 (7): 1257-1263 (2011)Planar Microstrip Ring Resonators for Microwave-Based Gas Sensing: Design Aspects and Initial Transducers for Humidity and Ammonia Sensing., , , , , and . Sensors, 17 (10): 2422 (2017)Revealing the Deposition Mechanism of the Powder Aerosol Deposition Method Using Ceramic Oxide Core-Shell Particles, , , , , , , , , and . Advanced materials, 36 (7): 2308294 (2023)Evaluation of compatibility of thick-film PTC thermistors and LTCC structures., , , , , , and . Microelectronics Reliability, 45 (12): 1924-1929 (2005)Pulsed Polarization-Based NOx Sensors of YSZ Films Produced by the Aerosol Deposition Method and by Screen-Printing., , , , and . Sensors, 17 (8): 1715 (2017)Metal-Organic Frameworks for Sensing Applications in the Gas Phase., , , , , and . Sensors, 9 (3): 1574-1589 (2009)Discontinuous Powder Aerosol Deposition : An Approach to Prepare Films Using Smallest Powder Quantities, , , , , and . Coatings, 11 (7): 844 (2021)Conductometric Soot Sensors: Internally Caused Thermophoresis as an Important Undesired Side Effect., , , , , and . Sensors, 18 (10): 3531 (2018)Novel Method for NTC Thermistor Production by Aerosol Co-Deposition and Combined Sintering., , , , , and . Sensors, 19 (7): 1632 (2019)Failure of electrical vias manufactured in thick-film technology when loaded with short high current pulses., , , , , , and . Microelectronics Reliability, (2016)