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Disambiguation of "Rinaldi, Niccolò"

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A 1.8 GHz Integrated LNA Using a Novel RF Si Technology

, , , , , and . 2002 proceedings : SAFE-ProRISC-SeSens, November 27 - 29, 2002, Veldhoven, the Netherlands, page 30-34. (2002)

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A 1.8 GHz Integrated LNA Using a Novel RF Si Technology, , , , , and . 2002 proceedings : SAFE-ProRISC-SeSens, November 27 - 29, 2002, Veldhoven, the Netherlands, page 30-34. (2002)Evaluation of thermal balancing techniques in InGaP/GaAs HBT power arrays for wireless handset power amplifiers., , , and . Microelectronics Reliability, 53 (9-11): 1471-1475 (2013)Analytical Solutions of the Diffusive Heat Equation as the Application for Multi-cellular Device Modeling - A Numerical Aspect., , , and . International Conference on Computational Science, volume 3039 of Lecture Notes in Computer Science, page 1021-1028. Springer, (2004)Dynamic electrothermal macromodeling techniques for thermal-aware design of circuits and systems., , , , and . PATMOS, page 227-230. IEEE, (2013)Avalanche multiplication and pinch-in models for simulating electrical instability effects in SiGe HBTs., , and . Microelectronics Reliability, 50 (9-11): 1577-1580 (2010)A Single Chip 1.8 GHz LNA and Power Amplifier With Improved Isolation Using Micromachining, , , , , , and . Book of abstracts : SAFE2001 Semiconductor Advances for Future Electronics, ProRISC2001 Program for Research on Integrated Systems and Circuits, SeSens2001 Semiconductor Sensor and Actuator Technology, Utrecht, STW, Technology Foundation, (2001)Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization., , , , , , , , , and . Microelectronics Reliability, (2018)TCAD Investigation of Vertical SiGe Base HBT with Lateral Collector Contact on Thin SOI, , , and . (2002)Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies., , , , , , and . Microelectronics Reliability, (2017)Design and characterization of a high-resistivity silicon traveling wave amplifier for 10 Gb/s optical communication systems, , , , and . Digest of papers : 2004 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 2004, page 69-72. Piscataway, New Jersey, IEEE, (2004)