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Development of Embedded Three-Dimensional 35-nF/mm2 MIM Capacitor and BiCMOS Circuits Characterization.

J. Giraudin, F. Badets, J. Blanc, E. Chataigner, C. Chappaz, J. Regolini, and P. Delpech. J. Solid-State Circuits, 42 (9): 1842-1850 (2007)

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Development of Embedded Three-Dimensional 35-nF/mm2 MIM Capacitor and BiCMOS Circuits Characterization.J. Giraudin, F. Badets, J. Blanc, E. Chataigner, C. Chappaz, J. Regolini, and P. Delpech. J. Solid-State Circuits, 42 (9): 1842-1850 (2007)Psychophysical Power Optimization of Friction Modulation for Tactile Interfaces.T. Sednaoui, E. Vezzoli, D. Gueorguiev, M. Amberg, C. Chappaz, and B. Lemaire-Semail. EuroHaptics (2), volume 9775 of Lecture Notes in Computer Science, page 354-362. Springer, (2016)Stress management strategy to limit die curvature during silicon interposer integration.B. Vianne, A. Farcy, V. Fiori, C. Chappaz, N. Chevrier, G. Lobascio, P. Chausse, F. Ponthenier, A. Ruckly, S. Escoubas and 1 other author(s). 3DIC, page TS11.4.1-TS11.4.7. IEEE, (2015)Friction Reduction through Ultrasonic Vibration Part 2: Experimental Evaluation of Intermittent Contact and Squeeze Film Levitation.T. Sednaoui, E. Vezzoli, B. Dzidek, B. Lemaire-Semail, C. Chappaz, and M. Adams. IEEE Trans. Haptics, 10 (2): 208-216 (2017)Experimental evaluation of friction reduction in ultrasonic devices.T. Sednaoui, E. Vezzoli, B. Dzidek, B. Lemaire-Semail, C. Chappaz, and M. Adams. World Haptics, page 37-42. IEEE, (2015)200°C direct bonding copper interconnects : Electrical results and reliability.L. Cioccio, R. Taibi, C. Chappaz, S. Moreau, L. Chapelon, and T. Signamarcheix. 3DIC, page 1-4. IEEE, (2011)Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric.T. Frank, S. Moreau, C. Chappaz, P. Leduc, L. Arnaud, A. Thuaire, E. Chery, F. Lorut, L. Anghel, and G. Poupon. Microelectronics Reliability, 53 (1): 17-29 (2013)

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Development of Embedded Three-Dimensional 35-nF/mm2 MIM Capacitor and BiCMOS Circuits Characterization.

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copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Development of Embedded Three-Dimensional 35-nF/mm2 MIM Capacitor and BiCMOS Circuits Characterization.

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Development of Embedded Three-Dimensional 35-nF/mm2 MIM Capacitor and BiCMOS Circuits Characterization.