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Optimization of efficiency and energy density of passive micro fuel cells and galvanic hydrogen generators

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Entwurf von Aufbau- und Verbindungstechniken für die Elektromagnetische Zuverlässigkeit von Mikrosystemen unter Verwendung des M3-Ansatzes., and . MBMV, page 1-2. Universitätsbibliothek Berlin, Germany, (2009)Embroidering Electrical Interconnects with Conductive Yarn for The Integration of Flexible Electronic Modules into Fabric., , , and . ISWC, page 86-91. IEEE Computer Society, (2005)Simulation and experimental analysis of large area substrate overmolding with epoxy molding compounds., , , and . Microelectronics Reliability, 51 (3): 668-675 (2011)Long time reliability study of soldered flip chips on flexible substrates., , , and . Microelectronics Reliability, 44 (2): 309-314 (2004)Parametric FE-approach to flip-chip reliability under various loading conditions., , , , and . Microelectronics Reliability, 44 (12): 1933-1945 (2004)Modellierung geschirmter Leistungskabel im Frequenzbereich der EMV., , , , , and . EMV, page 655-664. VDE-Verlag, (2006)Technologies for 3D Heterogeneous Integration, , , and . CoRR, (2008)Bump formation for flip chip and CSP by solder paste printing., , , and . Microelectronics Reliability, 42 (3): 391-398 (2002)3-D thin chip integration technology - from technology development to application., , , , , , , and . 3DIC, page 1-8. IEEE, (2009)SENESCOPE: A design tool for cost optimization of wireless sensor nodes., , , , and . IPSN, page 313-324. IEEE Computer Society, (2009)