%0 Journal Article %1 Holder.2021.High-quality %A Holder, Daniel %A Weber, Rudolf %A Röcker, Christoph %A Kunz, Gerhard %A Bruneel, David %A Delaigue, Martin %A Graf, Thomas %A Ahmed, Marwan Abdou %D 2021 %I OSA %J Opt. Lett. %K myown peer %N 2 %P 384--387 %R 10.1364/OL.411412 %T High-quality high-throughput silicon laser milling using a 1 kW sub-picosecond laser %U http://ol.osa.org/abstract.cfm?URI=ol-46-2-384 %V 46 %X We report on high-quality high-throughput laser milling of silicon with a sub-ps laser delivering more than 1 kW of average laser power on the workpiece. In order to avoid heat accumulation effects, the processing strategy for high-quality laser milling was adapted to the available average power by using five-pulse bursts, a large beam diameter of 372 µm to limit the peak fluence per pulse to approximately 0.7J/cm2, and a high feed rate of 24 m/s. As a result, smooth surfaces with a low roughness of Sa$łeq$0.6µm were achieved up to the investigated milling depth of 313 µm while maintaining a high material removal rate of 230mm3/min.

@article{Holder.2021.High-quality, abstract = {We report on high-quality high-throughput laser milling of silicon with a sub-ps laser delivering more than 1 kW of average laser power on the workpiece. In order to avoid heat accumulation effects, the processing strategy for high-quality laser milling was adapted to the available average power by using five-pulse bursts, a large beam diameter of 372 {\textmu}m to limit the peak fluence per pulse to approximately 0.7J/cm2, and a high feed rate of 24 m/s. As a result, smooth surfaces with a low roughness of Sa$\leq$0.6{\textmu}m were achieved up to the investigated milling depth of 313 {\textmu}m while maintaining a high material removal rate of 230mm3/min.}, added-at = {2021-01-13T18:01:47.000+0100}, author = {Holder, Daniel and Weber, Rudolf and R\"{o}cker, Christoph and Kunz, Gerhard and Bruneel, David and Delaigue, Martin and Graf, Thomas and Ahmed, Marwan Abdou}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/252e94f10a61961b702a47a8fe78ef354/danielholder}, doi = {10.1364/OL.411412}, interhash = {f61f08afe0e8d5f16c3bbf1ccc649040}, intrahash = {52e94f10a61961b702a47a8fe78ef354}, journal = {Opt. Lett.}, keywords = {myown peer}, month = jan, number = 2, pages = {384--387}, publisher = {OSA}, timestamp = {2021-02-27T10:55:26.000+0100}, title = {High-quality high-throughput silicon laser milling using a 1 kW sub-picosecond laser}, url = {http://ol.osa.org/abstract.cfm?URI=ol-46-2-384}, volume = 46, year = 2021 }