%0 Journal Article %1 soltani2019novel %A Soltani, Mahdi %A Kulkarni, Romit %A Scheinost, Tobias %A Grözinger, Tobias %A Zimmermann, André %D 2019 %I IEEE %J IEEE Access %K %P 56163-56173 %R 10.1109/ACCESS.2019.2913786 %T A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation %V 7

@article{soltani2019novel, added-at = {2023-08-31T16:41:51.000+0200}, affiliation = {Soltani, M (Reprint Author), Univ Stuttgart, Inst Micro Integrat IFM, D-70569 Stuttgart, Germany. Soltani, Mahdi; Scheinost, Tobias; Zimmermann, Andre, Univ Stuttgart, Inst Micro Integrat IFM, D-70569 Stuttgart, Germany. Kulkarni, Romit; Groezinger, Tobias; Zimmermann, Andre, Hahn Schickard, D-70569 Stuttgart, Germany.}, author = {Soltani, Mahdi and Kulkarni, Romit and Scheinost, Tobias and Grözinger, Tobias and Zimmermann, André}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/223f6f62a45a89b82292da5457ba5f628/puma-wartung}, doi = {10.1109/ACCESS.2019.2913786}, interhash = {a026794c49fe8726e2c0fa16c53b235f}, intrahash = {23f6f62a45a89b82292da5457ba5f628}, issn = {2169-3536}, journal = {IEEE Access}, keywords = {}, language = {eng}, pages = {56163-56173}, publisher = {IEEE}, research-areas = {Computer Science; Engineering; Telecommunications}, timestamp = {2023-08-31T14:41:51.000+0200}, title = {A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation}, unique-id = {ISI:000467703200001}, volume = 7, year = 2019 }