%0 Journal Article %1 BURGHARTZ2005409 %A Burghartz, J.N. %D 2005 %J Microelectronics Reliability %K tutorial %N 3 %P 409 - 418 %R https://doi.org/10.1016/j.microrel.2004.12.002 %T Review of add-on process modules for high-frequency silicon technology %U http://www.sciencedirect.com/science/article/pii/S0026271404005098 %V 45 %X Add-on process modules as enhancements for standard high-frequency silicon integration processes are discussed. Such modules can cost-effectively be added without any interference with the core process before (pre-process modules), during (mid-process modules), or after (post-process modules) the circuit integration. In addition, layout options providing a most cost-effective means of enhancement are discussed. High-resistivity silicon substrates, ferromagnetic thin-film integration, bulk micromachining, saddle-add-on metallization, spacer-substrate integration, and metal layer shunting are presented as examples in those categories.

@article{BURGHARTZ2005409, abstract = {Add-on process modules as enhancements for standard high-frequency silicon integration processes are discussed. Such modules can cost-effectively be added without any interference with the core process before (pre-process modules), during (mid-process modules), or after (post-process modules) the circuit integration. In addition, layout options providing a most cost-effective means of enhancement are discussed. High-resistivity silicon substrates, ferromagnetic thin-film integration, bulk micromachining, saddle-add-on metallization, spacer-substrate integration, and metal layer shunting are presented as examples in those categories.}, added-at = {2019-05-29T17:22:50.000+0200}, author = {Burghartz, J.N.}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/22c56f9aeee0c08d52e822552121fe941/kevin.konnerth}, description = {Review of add-on process modules for high-frequency silicon technology - ScienceDirect}, doi = {https://doi.org/10.1016/j.microrel.2004.12.002}, interhash = {972b8b8b97680ed3086cd507eea2ccac}, intrahash = {2c56f9aeee0c08d52e822552121fe941}, issn = {0026-2714}, journal = {Microelectronics Reliability}, keywords = {tutorial}, number = 3, pages = {409 - 418}, timestamp = {2019-05-29T15:24:42.000+0200}, title = {Review of add-on process modules for high-frequency silicon technology}, url = {http://www.sciencedirect.com/science/article/pii/S0026271404005098}, volume = 45, year = 2005 }