Additive manufacturing of sensors : printing of conductor paths in loaded structures
K. Werkle, W. Maier, S. Mayer, and H. Möhring. Proceedings of the 20th International Conference of the European Society for Precision Engineering and Nanotechnology, page 125-128. Bedford, euspen, (2020)
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%0 Conference Paper
%1 werkle2020additive
%A Werkle, Kim Torben
%A Maier, Walther
%A Mayer, Stephan
%A Möhring, Hans-Christian
%B Proceedings of the 20th International Conference of the European Society for Precision Engineering and Nanotechnology
%C Bedford
%D 2020
%E Leach, Richard
%E Billington, David
%E Nisbet, Clare
%E Phillips, Dishi
%I euspen
%K
%P 125-128
%T Additive manufacturing of sensors : printing of conductor paths in loaded structures
%U https://www.euspen.eu/resource/additive-manufacturing-of-sensors-printing-of-conductor-paths-in-loaded-damping-structures/
%@ 978-0-9957751-7-6
@inproceedings{werkle2020additive,
added-at = {2024-09-26T10:41:08.000+0200},
address = {Bedford},
author = {Werkle, Kim Torben and Maier, Walther and Mayer, Stephan and Möhring, Hans-Christian},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2fb02bce036ab2a7a97c4760b55f4384e/unibiblio},
booktitle = {Proceedings of the 20th International Conference of the European Society for Precision Engineering and Nanotechnology},
editor = {Leach, Richard and Billington, David and Nisbet, Clare and Phillips, Dishi},
eventdate = {2020-06-08/2020-06-12},
eventtitle = {euspen’s 20th International Conference & Exhibition},
interhash = {95c672844f909a058faee3fef5cee503},
intrahash = {fb02bce036ab2a7a97c4760b55f4384e},
isbn = {978-0-9957751-7-6},
keywords = {},
language = {eng},
pages = {125-128},
publisher = {euspen},
timestamp = {2024-09-26T08:41:08.000+0200},
title = {Additive manufacturing of sensors : printing of conductor paths in loaded structures},
url = {https://www.euspen.eu/resource/additive-manufacturing-of-sensors-printing-of-conductor-paths-in-loaded-damping-structures/},
venue = {Online},
year = 2020
}