%0 Journal Article %1 jeronimo2023influence %A Jeronimo, Mateus Bagetti %A Schindele, Jens %A Straub, Hubert %A Gromala, Przemyslaw Jakub %A Wunderle, Bernhard %A Zimmermann, André %D 2023 %I Elsevier %J Microelectronics reliability %K %N January %P 114869 %R 10.1016/j.microrel.2022.114869 %T On the influence of lid materials for flip-chip ball grid array package applications %V 140

@article{jeronimo2023influence, added-at = {2023-05-16T13:05:55.000+0200}, affiliation = {Jeronimo, MB (Corresponding Author), Bosch GmbH, Tubinger Str 123, D-72762 Reutlingen, Germany. Jeronimo, Mateus Bagetti; Schindele, Jens; Straub, Hubert; Gromala, Przemyslaw Jakub, Automot Elect Robert Bosch GmbH, D-72762 Reutlingen, Germany. Wunderle, Bernhard, Tech Univ Chemnitz, Chair Mat & Reliabil Microsyst, D-09126 Chemnitz, Germany. Wunderle, Bernhard, Univ Stuttgart, Inst Micro Integrat IFM, D-70569 Stuttgart, Germany. Wunderle, Bernhard, Hahn Schickard, D-70569 Stuttgart, Germany. Jeronimo, Mateus Bagetti, Bosch GmbH, Tubinger Str 123, D-72762 Reutlingen, Germany.}, author = {Jeronimo, Mateus Bagetti and Schindele, Jens and Straub, Hubert and Gromala, Przemyslaw Jakub and Wunderle, Bernhard and Zimmermann, André}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/28ad59e6e234367a02f6617eb6ebed7e5/unibiblio}, doi = {10.1016/j.microrel.2022.114869}, interhash = {8200dfceacd436a69cf3a44bfead3030}, intrahash = {8ad59e6e234367a02f6617eb6ebed7e5}, issn = {{0026-2714} and {1872-941X}}, journal = {Microelectronics reliability}, keywords = {}, language = {eng}, number = {January}, pages = 114869, publisher = {Elsevier}, research-areas = {Engineering; Science & Technology - Other Topics; Physics}, timestamp = {2023-05-16T13:05:58.000+0200}, title = {On the influence of lid materials for flip-chip ball grid array package applications}, unique-id = {WOS:000901982500001}, volume = 140, year = 2023 }