%0 Journal Article %1 soltani2018reliability %A Soltani, Mahdi %A Freyburger, Moritz %A Kulkarni, Romit %A Mohr, Rainer %A Grözinger, Tobias %A Zimmermann, André %D 2018 %I IEEE %J IEEE Access %K %P 51669-51679 %R 10.1109/ACCESS.2018.2869017 %T Reliability Study and Thermal Performance of LED on Molded Interconnect Devices (MID) aim PCB %V 6

@article{soltani2018reliability, added-at = {2023-08-31T15:02:47.000+0200}, affiliation = {Soltani, M (Reprint Author), Univ Stuttgart, Inst Micro Integrat, D-70569 Stuttgart, Germany. Soltani, Mahdi; Freyburger, Moritz; Mohr, Rainer; Zimmermann, Andre, Univ Stuttgart, Inst Micro Integrat, D-70569 Stuttgart, Germany. Kulkarni, Romit; Groezinger, Tobias; Zimmermann, Andre, Hahn Schickard, D-70569 Stuttgart, Germany.}, author = {Soltani, Mahdi and Freyburger, Moritz and Kulkarni, Romit and Mohr, Rainer and Grözinger, Tobias and Zimmermann, André}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/24332c68552b6eb7751e875f33b659632/puma-wartung}, doi = {10.1109/ACCESS.2018.2869017}, interhash = {77e1fe87469a77d0c67c6bbddec83ab2}, intrahash = {4332c68552b6eb7751e875f33b659632}, issn = {2169-3536}, journal = {IEEE Access}, keywords = {}, language = {eng}, orcid-numbers = {Soltani, Mahdi/0000-0002-9493-7704 Kulkarni, Romit/0000-0001-7594-4207 Groezinger, Tobias/0000-0002-1826-3592}, pages = {51669-51679}, publisher = {IEEE}, research-areas = {Computer Science; Engineering; Telecommunications}, timestamp = {2023-08-31T13:02:47.000+0200}, title = {Reliability Study and Thermal Performance of LED on Molded Interconnect Devices (MID) aim PCB}, unique-id = {ISI:000446964100001}, volume = 6, year = 2018 }