We report on high-quality high-throughput laser milling of silicon with a sub-ps laser delivering more than 1 kW of average laser power on the workpiece. In order to avoid heat accumulation effects, the processing strategy for high-quality laser milling was adapted to the available average power by using five-pulse bursts, a large beam diameter of 372 µm to limit the peak fluence per pulse to approximately 0.7J/cm2, and a high feed rate of 24 m/s. As a result, smooth surfaces with a low roughness of Sa$łeq$0.6µm were achieved up to the investigated milling depth of 313 µm while maintaining a high material removal rate of 230mm3/min.
%0 Journal Article
%1 Holder.2021.High-quality
%A Holder, Daniel
%A Weber, Rudolf
%A Röcker, Christoph
%A Kunz, Gerhard
%A Bruneel, David
%A Delaigue, Martin
%A Graf, Thomas
%A Ahmed, Marwan Abdou
%D 2021
%I OSA
%J Opt. Lett.
%K myown peer
%N 2
%P 384--387
%R 10.1364/OL.411412
%T High-quality high-throughput silicon laser milling using a 1 kW sub-picosecond laser
%U http://ol.osa.org/abstract.cfm?URI=ol-46-2-384
%V 46
%X We report on high-quality high-throughput laser milling of silicon with a sub-ps laser delivering more than 1 kW of average laser power on the workpiece. In order to avoid heat accumulation effects, the processing strategy for high-quality laser milling was adapted to the available average power by using five-pulse bursts, a large beam diameter of 372 µm to limit the peak fluence per pulse to approximately 0.7J/cm2, and a high feed rate of 24 m/s. As a result, smooth surfaces with a low roughness of Sa$łeq$0.6µm were achieved up to the investigated milling depth of 313 µm while maintaining a high material removal rate of 230mm3/min.
@article{Holder.2021.High-quality,
abstract = {We report on high-quality high-throughput laser milling of silicon with a sub-ps laser delivering more than 1 kW of average laser power on the workpiece. In order to avoid heat accumulation effects, the processing strategy for high-quality laser milling was adapted to the available average power by using five-pulse bursts, a large beam diameter of 372 {\textmu}m to limit the peak fluence per pulse to approximately 0.7J/cm2, and a high feed rate of 24 m/s. As a result, smooth surfaces with a low roughness of Sa$\leq$0.6{\textmu}m were achieved up to the investigated milling depth of 313 {\textmu}m while maintaining a high material removal rate of 230mm3/min.},
added-at = {2021-01-13T18:01:47.000+0100},
author = {Holder, Daniel and Weber, Rudolf and R\"{o}cker, Christoph and Kunz, Gerhard and Bruneel, David and Delaigue, Martin and Graf, Thomas and Ahmed, Marwan Abdou},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/252e94f10a61961b702a47a8fe78ef354/danielholder},
doi = {10.1364/OL.411412},
interhash = {f61f08afe0e8d5f16c3bbf1ccc649040},
intrahash = {52e94f10a61961b702a47a8fe78ef354},
journal = {Opt. Lett.},
keywords = {myown peer},
month = jan,
number = 2,
pages = {384--387},
publisher = {OSA},
timestamp = {2021-02-27T10:55:26.000+0100},
title = {High-quality high-throughput silicon laser milling using a 1 kW sub-picosecond laser},
url = {http://ol.osa.org/abstract.cfm?URI=ol-46-2-384},
volume = 46,
year = 2021
}
